| 发明名称 |
DEVICE COMPRISING A THREE-DIMENSIONAL INTEGRATED STRUCTURE WITH SIMPLIFIED THERMAL DISSIPATION, AND CORRESPONDING FABRICATION METHOD |
| 摘要 |
A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid. |
| 申请公布号 |
US2015200151(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201514590404 |
申请日期 |
2015.01.06 |
| 申请人 |
STMICROELECTRONICS SA ;STMICROELECTRONICS (CROLLES 2) SAS |
发明人 |
LHOSTIS Sandrine;Kokshagina Olga;Beilliard Yann;Fiori Vincent |
| 分类号 |
H01L23/473;H01L21/56;H01L23/31 |
主分类号 |
H01L23/473 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
Montrouge FR |
