| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device is provided, wherein the semiconductor device comprises a carrier, wherein the carrier comprises a first portion configured to hold a semiconductor chip; and a second portion configured for mounting the semiconductor device to a support, the second portion further comprising a first feature configured to be connected to the support; and at least one second feature configured to facilitate transfer of heat away from the first portion, wherein the at least one second feature increases a surface area of the second portion. |
| 申请公布号 |
US2015200148(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201414153003 |
申请日期 |
2014.01.11 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
PON Tiam Meng;TAN Tian San;LONG Theng Chao |
| 分类号 |
H01L23/367;H01L21/48;H01L23/31;H01L23/14;H01L23/13 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a carrier, comprising:
a first portion configured to hold a semiconductor chip; anda second portion configured for mounting the semiconductor device to a support, the second portion further comprising:
a first feature configured to be connected to the support; andat least one second feature configured to facilitate transfer of heat away from the first portion, wherein the at least one second feature increases a surface area of the second portion. |
| 地址 |
Villach AT |
