INSULATING LAYER FOR PRINTED WIRE BOARD, AND PRINTED WIRE BOARD

摘要

The present invention has the objective of providing an insulating layer, for a printed wire board, which can reduce warpage at manufacturing time for a semiconductor plastic package. The insulating layer includes a resin composition, wherein the resin composition includes an alkenyl-substituted nadimide (A), a maleimide compound (B), a cyanate ester compound (C), and an inorganic filler (D). The content of the cyanate ester compound (C) is 5 to 15 parts by weight with respect to a total of 100 parts by weight for components (A) to (C), wherein the ratio (β/α) between alkenyl groups (α) in the alkenyl-substituted nadimide (A) and maleimide groups (β) in the maleimide compound (B) is 0.9 to 4.3, and the difference between the flexural modulus at 25°C and the flexural modulus when heated at 250°C is within 20%.