| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board having excellent heat radiation characteristics, in which a crack hardly occurs in a support substrate made of ceramic, and to provide electronic equipment using the circuit board. <P>SOLUTION: The circuit board includes the support substrate 21 made of ceramic and a circuit member 51, wherein a thermally conductive member 41 containing as a principal component an isotropic graphite is arranged between the support substrate 21 and circuit member 51. The circuit board 1 has the superior excellent heat radiation characteristics since the thermally conductive member 41 has high thermal conductivity and dissipates heat, generated during operation of an electronic component such as a semiconductor element, mounted on the circuit member 51, speedily without being biased to a specific direction. Further, tensile stress generated in the support substrate 21 is absorbed by the thermal conductive member 41 having low rigidity, so that warpage arising in the support substrate 21 is reducible. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
