| 摘要 |
<p>The present invention relates to a thermoplastic polyamide resin used as a binder for molding an outer material of a connector for an electronic material and a manufacturing method thereof and, more specifically, to a thermoplastic polyamide resin used as an outer material of a connector for an electronic material and a manufacturing method thereof, which comprises: 90-100 parts by weight of a polymeric fatty acid, carboxylic acid, dicarboxylic acid, or monocarboxylic acid; and 90-100 parts by weight aliphatic diamine, cyclic aliphatic diamine, or polyoxyalkylene diamine in an equivalent ratio of 1:1.05. A polyamide resin of the present invention with excellent adhesive power, air-tightness, and water-tightness for a substrate, has excellent effects in protecting the inside of a connector.</p> |
