| 摘要 |
This bonding-wire copper strand is used to form a bonding wire. Said copper strand is formed from highly pure copper having a purity of at least 99.9999 mass%, and has a strand diameter between 0.5 mm to 3.5 mm inclusive. The surface area ratio of the (001) plane is between 15% and 30% inclusive at a cross section perpendicular to the drawing direction. |
