发明名称 配線構造体、配線構造体の製造方法、及びタッチパネル
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring structure capable of achieving reduction in contact resistance and high visibility, a method for manufacturing the wiring structure, and a touch panel. <P>SOLUTION: The wiring structure includes: a transparent substrate 20; a pad part 60b formed on the transparent substrate 20; and a first transparent conductive pattern 30 that includes a binder electrically connected to the pad part 60b, and a conductive fiber. A weight ratio (conductive fiber/binder) of the conductive fiber to the binder is set larger in the contact area C1 between the pad part 60b and a connecting part 36 compared with an area other than the contact area C of the first transparent conductive pattern 30. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5750017(B2) 申请公布日期 2015.07.15
申请号 JP20110212934 申请日期 2011.09.28
申请人 发明人
分类号 G06F3/041 主分类号 G06F3/041
代理机构 代理人
主权项
地址