Polyamide moulding material and moulded body produced from the same

摘要

Polyamide molding composition comprises (a) 82-96 wt.% at least one polyamide including e.g. polyamide of bis(3-methyl-4-aminocyclohexyl)methane and dodecanedioic acid, polyamide-bis(3-methyl-4-aminocyclohexyl)methane and tetradecanedioic acid or polyamide of bis(4-aminocyclohexyl)methane and/or tetradecanedioic acid, and copolyamides, (b) 4-18 wt.% a functionalized styrene-ethylene/butylene-styrene block copolymer as an impact modifier, and (c) 0-8 wt.% further additives, each based on the sum of components (a)-(c). The sum of components (a)-(c) is 100 wt.%. Polyamide molding composition comprises (a) 82-96 wt.% at least one polyamide including polyamide of bis(3-methyl-4-aminocyclohexyl)methane and dodecanedioic acid, polyamide of bis(4-amino-cyclohexyl)methane and dodecanedioic acid, polyamide of bis(3-methyl-4-aminocyclohexyl)methane and decanedioic acid, polyamide of bis(4-aminocyclohexyl)methane and decanedioic acid, polyamide-bis(3-methyl-4-aminocyclohexyl)methane and tetradecanedioic acid or polyamide of bis(4-aminocyclohexyl)methane and/or tetradecanedioic acid, and copolyamides, (b) 4-18 wt.% a functionalized styrene-ethylene/butylene-styrene block copolymer as an impact modifier, and (c) 0-8 wt.% further additives, each based on the sum of components (a)-(c). The sum of components (a)-(c) is 100 wt.%.