摘要 |
Disclosed are a photosensitive compound, a cured film of which has high flexibility, excellent chemical resistance, excellent heat resistance and good quick-curability and which can be recycled from waste plastics, and a photocuring resin composition comprising said photosensitive compound. Specifically disclosed is a photosensitive compound obtained by depolymerizing a polyester using a polyol having a plurality of hydroxyl groups per molecule, and then reacting the depolymerized product with a compound having a functional group, which is capable of reacting with a hydroxyl group, and an ethylenically unsaturated group. In a preferred case, said polyol having a plurality of hydroxyl groups per molecule is characterized by containing trimethylolpropane as a component thereof. |