发明名称 半導体装置
摘要 <p>A semiconductor substrate of a semiconductor device includes a body region of a first conductivity type, a drift region of a second conductivity type coming into contact with a lower surface of the body region, a gate electrode that is provided in a gate trench passing through the body region and extending to the drift region and faces the body region, and a gate insulator that is provided between the gate electrode and a wall surface of the gate trench. An inverted U-shaped section is formed in a lower surface of the gate insulator, and a floating region of the first conductivity type is formed in the inverted U-shaped section. The floating region protrudes under a portion that is located at a lowermost portion in the lower surface of the gate insulator.</p>
申请公布号 JP5747891(B2) 申请公布日期 2015.07.15
申请号 JP20120224078 申请日期 2012.10.09
申请人 发明人
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
代理机构 代理人
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