| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing slurry which can enhance throughput in polishing of TSV. <P>SOLUTION: The polishing slurry is used in polishing of a barrier metal, copper and silicon dioxide composing a silicon through via. The polishing slurry contains colloidal silica having an average particle diameter of 30 nm, colloidal silica having an average particle diameter of 80 nm, a malonic acid, L-alanine, benzotriazol, phosphoric acid, sodium dodecylbenzenesulfonate, and sodium dinonylsulfosuccinate. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
