| 摘要 |
In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided. |
