| 发明名称 | Component having a via | ||
| 摘要 | A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap. | ||
| 申请公布号 | US9082831(B2) | 申请公布日期 | 2015.07.14 |
| 申请号 | US201113199748 | 申请日期 | 2011.09.07 |
| 申请人 | ROBERT BOSCH GMBH | 发明人 | Ahles Marcus;Reinmuth Jochen;Benzel Hubert;Armbruster Simon |
| 分类号 | H01L23/48;H01L21/768;B81C1/00;H01L21/764 | 主分类号 | H01L23/48 |
| 代理机构 | Kenyon & Kenyon LLP | 代理人 | Kenyon & Kenyon LLP |
| 主权项 | 1. A component having a via, comprising: a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, wherein the first via portion is separated by the first trench structure from the first surrounding layer portion; a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, wherein the second via portion is separated by the second trench structure from the second surrounding layer portion; and an insulation layer disposed between the first and the second layer, wherein the insulation layer has an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening; wherein the first via portion of the first layer and the second surrounding layer portion of the second layer are disposed overlappingly with one another at least in a sub-region; and wherein the first and second via portions of the first and second layers are each provided with a metallization applied onto an entire surface of each of the first and second lavers, the respective surfaces positioned opposite the insulation layer between the first and second layers. | ||
| 地址 | Stuttgart DE | ||