Substrate collecting method

摘要

Even in case that a wafer is so greatly deviated that a peripheral portion of the wafer cannot be detected, position determination of the wafer can be performed without inflicting a damage on the wafer. The wafer peripheral portion, which is a target, is detected based on output images from a plurality of imaging units disposed along a peripheral portion shape of the wafer (step S210), and a wafer position deviation correcting step (step S220) or a rough correcting step (step 230) is performed according to the number of the imaging units capable of detecting the wafer peripheral portion. In case that the wafer peripheral portion cannot be detected by all the imaging units, a wafer position adjusting step (step 240) for moving the wafer is performed in a position adjusting direction acquired by a combination of the output images by each imaging unit.

主权项

1. A substrate collecting method for withdrawing a substrate by a transfer arm, the method comprising:
a substrate peripheral portion detecting step for detecting a peripheral portion of the substrate, which is a target to be withdrawn, based on output images from a plurality of imaging units disposed along a peripheral portion shape of the substrate; a substrate position deviation correcting step for, when the peripheral portion of the substrate can be detected by at least one imaging unit, acquiring a positional deviation from a preset reference position based on a horizontal position of the substrate obtained from a shape of the detected peripheral portion, and correcting the positional deviation by moving the substrate in a horizontal direction if the deviation exceeds a withdrawable range; and a substrate collecting step for withdrawing the substrate by the transfer arm when the deviation does not exceed the withdrawable range, or when the deviation is reduced not to exceed the withdrawable range through the substrate position deviation correcting step.