发明名称 Display device including a touch sensor and method for manufacturing display device including a touch sensor
摘要 The thickness of a display device including a touch sensor is reduced. Alternatively, the thickness of a display device having high display quality is reduced. Alternatively, a method for manufacturing a display device with high mass productivity is provided. Alternatively, a display device having high reliability is provided. Stacked substrates in each of which a sufficiently thin substrate and a relatively thick support substrate are stacked are used as substrates. One surface of the thin substrate of one of the stacked substrates is provided with a layer including a touch sensor, and one surface of the thin substrate of the other stacked substrate is provided with a layer including a display element. After the two stacked substrates are attached to each other so that the touch sensor and the display element face each other, the support substrate and the thin substrate of each stacked substrate are separated from each other.
申请公布号 US9082678(B2) 申请公布日期 2015.07.14
申请号 US201313938532 申请日期 2013.07.10
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Yamazaki Shunpei;Hirakata Yoshiharu;Yoshizumi Kensuke
分类号 H01L29/10;H01L27/15;H01L21/82;H01L51/00;H01L27/32;G06F3/041;G06F3/044;H01L29/786 主分类号 H01L29/10
代理机构 Husch Blackwell LLP 代理人 Husch Blackwell LLP
主权项 1. A display device comprising: a first substrate; a first layer over the first substrate, the first layer including a light-emitting element; a first conductive layer over the first substrate; a second substrate over the first conductive layer, the second substrate being provided with a second layer including a touch sensor; and a second conductive layer under the second substrate, the second conductive layer being electrically connected to the touch sensor, wherein the first substrate and the second substrate are attached to each other with an adhesive layer so that the first layer and the second layer are interposed between the first substrate and the second substrate, wherein the first conductive layer is electrically connected to the second conductive layer through a conductive connector, wherein each of the first substrate and the second substrate is a glass substrate, and wherein each of the first substrate and the second substrate has a thickness of 10 μm to 200 μm.
地址 JP