发明名称 |
Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device |
摘要 |
An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements, a reinforcing member and a ventilation passage. The substrate defines a plurality of openings arranged in an array pattern. The ultrasonic transducer elements are respectively disposed at the openings on a first surface of the substrate. The reinforcing member is fixed on a second surface of the substrate opposite to the first surface of the substrate to reinforce the substrate. Through the ventilation passage, internal spaces of the openings and an external space of the substrate are in communication with each other. |
申请公布号 |
US9079220(B2) |
申请公布日期 |
2015.07.14 |
申请号 |
US201313804872 |
申请日期 |
2013.03.14 |
申请人 |
Seiko Epson Corporation |
发明人 |
Nakamura Tomoaki;Tsuruno Jiro;Kiyose Kanechika |
分类号 |
B06B1/06;G03B42/06 |
主分类号 |
B06B1/06 |
代理机构 |
Global IP Counselors, LLP |
代理人 |
Global IP Counselors, LLP |
主权项 |
1. An ultrasonic transducer element chip comprising:
a substrate defining a plurality of openings arranged in an array pattern; a plurality of ultrasonic transducer elements respectively disposed at the openings on a first surface of the substrate; a reinforcing member fixed on a second surface of the substrate opposite to the first surface of the substrate to reinforce the substrate; and a ventilation passage through which internal spaces of the openings and an external space of the substrate are in communication with each other. |
地址 |
Tokyo JP |