| 发明名称 | Al bond pad clean method | ||
| 摘要 | Embodiments of the present disclosure provide a method for controlling moisture from substrate being processed. Particularly, embodiments of the present disclosure provide methods for removing moisture from polymer materials adjacent bond pad areas. One embodiment of the present includes providing a moisture sensitive precursor and forming a compound from a reaction between the moisture to be controlled and the moisture sensitive precursor. | ||
| 申请公布号 | US9082828(B2) | 申请公布日期 | 2015.07.14 |
| 申请号 | US201314055947 | 申请日期 | 2013.10.17 |
| 申请人 | APPLIED MATERIALS, INC. | 发明人 | Chang Mei |
| 分类号 | H01L21/768;H01L21/02;H01L23/00;H01L21/3105;H01L23/29;H01L23/31 | 主分类号 | H01L21/768 |
| 代理机构 | Patterson & Sheridan, LLP | 代理人 | Patterson & Sheridan, LLP |
| 主权项 | 1. A method for processing a substrate, comprising: removing moisture in one or more films on the substrate by: providing a moisture sensitive precursor that is a gas or vapor, wherein the moisture sensitive precursor comprises a metal or silicon; andforming a compound on the substrate from a reaction between the moisture in the one or more films and the moisture sensitive precursor, wherein the compound comprises an oxide of the metal or silicon. | ||
| 地址 | Santa Clara CA US | ||