3DIC packages with heat dissipation structures

摘要

A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM.

主权项

1. A package comprising:
a first die; a second die underlying the first die and in a same first die stack as the first die, wherein the second die comprises:
a first portion overlapped by the first die; anda second portion not overlapped by the first die, wherein the second die comprises a high-power-consuming circuit and a low-power-consuming circuit consuming less power than the high-power-consuming circuit, and the high-power-consuming circuit is at least partially located in the second portion of the second die; a first Thermal Interface Material (TIM) over and contacting a top surface of the first die; a heat dissipating lid comprising a first bottom surface contacting the first TIM; a second TIM over and contacting the second portion of the second die; and a heat dissipating ring over and contacting the second TIM.