发明名称 Solder joint with a multilayer intermetallic compound structure
摘要 A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a Cu3Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (Cu1-x1-y1Nix1Pdy1)6Sn5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (Cu1-x2-y2Nix2Pdy2)6Sn5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1.
申请公布号 US9079272(B2) 申请公布日期 2015.07.14
申请号 US201313778160 申请日期 2013.02.27
申请人 Yuan Ze University 发明人 Ho Cheng-En;Wang Shih-Ju;Wu Yu-Hui
分类号 B23K35/26;B23K35/24;B23K35/30 主分类号 B23K35/26
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. A solder joint with a multilayer intermetallic compound (IMC) structure, comprising: a Cu pad; a Sn-based solder, containing Cu and Ag and disposed opposite to the Cu pad, wherein the Cu content in the Sn-based solder is equal to 0.3 wt. % of the total weight of the Sn-based solder, and the Ag content in the Sn-based solder is equal to 5 wt. % of the total weight of the Sn-based solder; a first IMC layer, disposed between the Cu pad and the Sn-based solder, with the first IMC layer being a Cu3Sn layer; a second IMC layer, disposed between the first IMC layer and the Sn-based solder, with the second IMC layer being a (Cu1-x1-y1Nix1Pdy1)6Sn5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02, and wherein the second IMC layer further comprises Ag, and the Ag content in the second IMC layer is up to 3 wt. % of the total weight of the second IMC layer; and a third IMC layer, disposed between the second IMC layer and the Sn-based solder, and the third IMC layer is a (Cu1-x2-y2Nix2Pdy2)6Sn5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1, and wherein the third IMC layer further comprises Ag, and the Ag content in the third IMC layer is up to 3 wt. % of the total weight of the third IMC layer.
地址 Taoyuan County TW