Printed circuit board and printed wiring board

摘要

On a surface layer of a printed wiring board, main power supply patterns to be applied with different DC voltages are disposed in a second region. Power supply patterns are disposed on the surface layer, and the power supply patterns are led from the main power supply patterns to a first region. The power supply patterns connect power supply terminals of terminal groups in the second region. The power supply patterns connect the power supply terminals between the terminal groups in the first region. Power supply terminals of the terminal groups of a semiconductor package are electrically connected to the main power supply patterns by the power supply patterns. Thus, potential fluctuations are reduced and radiation noise is suppressed, and the number of layers of the printed wiring board is reduced.

主权项

1. A printed circuit board, comprising:
a printed wiring board comprising:
a first main power supply pattern to be applied with a first DC voltage;a second main power supply pattern to be applied with a second DC voltage different from the first DC voltage;a first power supply pattern which is formed on a surface layer and is electrically connected to the first main power supply pattern; anda second power supply pattern which is formed on the surface layer and is electrically connected to the second main power supply pattern; a semiconductor package mounted on the surface layer of the printed wiring board, the semiconductor package comprising:
a main body part comprising a semiconductor element which drives with the first DC voltage and the second DC voltage; andmultiple terminal groups which are electrically connected to the semiconductor element and are arranged with spaces in a circumferential direction of the main body part so as to protrude externally from the main body part,each of the multiple terminal groups comprising:
a first power supply terminal and a second power supply terminal to be supplied with the first DC voltage via the first power supply pattern; anda third power supply terminal and a fourth power supply terminal to be supplied with the second DC voltage via the second power supply pattern, the third power supply terminal and the fourth power supply terminal being disposed to sandwich the first power supply terminal and the second power supply terminal,the first power supply terminal, the second power supply terminal, the third power supply terminal, and the fourth power supply terminal being disposed in order of the third power supply terminal, the first power supply terminal, the second power supply terminal, and the fourth power supply terminal in the each of the multiple terminal groups, wherein, when a region of the surface layer opposed to the main body part is defined as a first region and a region of the surface layer other than the first region is defined as a second region: the first power supply pattern extending from the first main power supply pattern is led from the second region to the first region and is wired to connect the first power supply terminals and the second power supply terminals of the multiple terminal groups; the second power supply pattern extending from the second main power supply pattern is led from the second region to the first region and is wired in a single stroke manner so as to connect the third power supply terminals and the fourth power supply terminals of the multiple terminal groups in this order; the third power supply terminal and the fourth power supply terminal in the same terminal group are connected to each other in the second region; the third power supply terminal of one of two different terminal groups among the multiple terminal groups and the fourth power supply terminal of another one of the two different terminal groups are connected to each other in the first region; and the second power supply pattern is disposed on an outer perimeter side of the semiconductor package with respect to the first power supply pattern when viewed from a center of the semiconductor package.