Manufacturing method of circuit board

摘要

A manufacturing method of a circuit board is provided. Providing a substrate, where a first laser resistant structure is disposed on a first dielectric layer and at the periphery of a pre-removing area, a second dielectric layer covers the first laser resistant structure, a circuit layer is disposed on the second dielectric layer, a second laser resistant structure is disposed on the second dielectric layer and at the periphery of the pre-removing area, a third dielectric layer covers the circuit layer and the second laser resistant structure. There are gaps between the second laser resistant structure and the circuit layer, and the vertical projection of the gaps on the first dielectric layer overlaps the first laser resistant structure. A laser machining process is performed to etch the third dielectric layer at the periphery of the pre-removing area. The portion of the third dielectric layer within the pre-removing area is removed.

主权项

1. A manufacturing method of a circuit board, comprising:
providing a substrate, wherein the substrate has a pre-removing area, and the substrate comprises:
a first dielectric layer;a first laser resistant structure, disposed on a first surface of the first dielectric layer and located at a periphery of the pre-removing area;a second dielectric layer, disposed on the first dielectric layer and covering the first laser resistant structure;a circuit layer, disposed on a second surface of the second dielectric layer, wherein a portion of the circuit layer is extended from outside of the pre-removing area into the pre-removing area;a second laser resistant structure, disposed on the second surface, located at the periphery of the pre-removing area, and insulated from the circuit layer, wherein there is at least one gap between the second laser resistant structure and the circuit layer, and a vertical projection of the gap on the first surface overlaps the first laser resistant structure;a third dielectric layer, disposed on the second dielectric layer, and covering the circuit layer and the second laser resistant structure; performing a laser machining process to etch the third dielectric layer located at the periphery of the pre-removing area; removing a portion of the third dielectric layer located within the pre-removing area; and performing an etching process or a mechanical processing to remove the second laser resistant structure.