Semiconductor component and method of manufacture

摘要

A semiconductor component and a method for manufacturing the semiconductor component. In accordance with an embodiment, the semiconductor component includes a plurality of stacked semiconductor chips mounted to a support structure, wherein one semiconductor chip has a side with a plurality of electrical contacts electrically coupled to conductive tabs of the support structure. An electrical connector electrically connects an electrical contact formed from a side opposite the side with the plurality of electrical contacts to a corresponding conductive tab. Another semiconductor chip is mounted to the electrical connector and electrical contacts formed from this semiconductor chip are electrically connected to corresponding conductive tabs of the support structure.

主权项

1. A semiconductor component, comprising:
a support structure having at least first, second, third, fourth, and fifth electrically conductive tabs; a first semiconductor chip having first and second sides, wherein first and second electrical contacts are formed on the first side of the first semiconductor chip and a third electrical contact is formed on the second side of the first semiconductor chip, the first electrical contact directly coupled to the first electrically conductive tab and the second electrical contact directly coupled to the second electrically conductive tab; a first electrical connector having first and second ends, the first end of the first electrical connector directly coupled to the third electrically conductive tab and the second end of the first electrical connector directly coupled to the third electrical contact of the first semiconductor chip; and a second semiconductor chip having first and second sides, wherein first and second electrical contacts are formed on the first side of the second semiconductor chip and a third electrical contact is formed on the second side of the second semiconductor chip, the third electrical contact of the second semiconductor chip directly coupled to the second end of the first electrical connector, the first electrical contact of the second semiconductor chip electrically coupled to the fourth electrically conductive tab and the second electrical contact of the second semiconductor chip electrically coupled to the fifth electrically conductive tab.