发明名称 Thin chassis near field communication (NFC) antenna integration
摘要 Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
申请公布号 US9083073(B2) 申请公布日期 2015.07.14
申请号 US201213536733 申请日期 2012.06.28
申请人 Intel Corporation 发明人 Yang Songnan;Hsu Hao-Han;Karacaoglu Ulun;Konanur Anand S;Hong Yee Wei Eric
分类号 H01Q1/24;H01Q1/22;H01Q1/44;H01Q7/00 主分类号 H01Q1/24
代理机构 Forefront IP Lawgroup, PLLC 代理人 Forefront IP Lawgroup, PLLC
主权项 1. A portable device comprising: one or more processors; a memory configured to the processors; a near field communications (NFC) antenna configured to the processors wherein the NFC antenna is integrated underneath a metal chassis of the portable device, the metal chassis is constructed to include one or more slots that are perpendicular to Eddy current induced by the NFC antenna, wherein the metal chassis includes an embedded or attached conductive coating, the conductive coating is located between the metal chassis and the NFC antenna, wherein the one or more slots define an area in the conductive coating, the area includes one or more grounding points to provide electrostatic discharge (ESD) protection.
地址 Santa Clara CA US