发明名称 Multi-die LED package
摘要 A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads.
申请公布号 US9082921(B2) 申请公布日期 2015.07.14
申请号 US201213441620 申请日期 2012.04.06
申请人 Cree, Inc. 发明人 Wilcox Kurt S.;Keller Bernd P.;Lowes Theodore;Andrews Peter Scott
分类号 H01L33/00;H01L33/08;H01L33/48;H01L31/12;H01L33/62;H01L33/64;H01L25/075;H01L33/54;H01L33/40 主分类号 H01L33/00
代理机构 Jenkins, Wilson, Taylor & Hunt, P.A. 代理人 Jenkins, Wilson, Taylor & Hunt, P.A.
主权项 1. A light-emitting device comprising: a submount having front and back sides and including a ceramic layer; an array of light emitting diodes (LEDs) on the front side; and an asymmetric lens overmolded on the submount and covering the LED array; wherein: the submount comprises at least three contact pads, including a positive contact pad, a negative contact pad, and at least one intermediate contact pad;a first subset of the LEDs is secured with respect to one of the positive and negative contact pads; anda second subset of the LEDs is secured with respect to one of the at least one intermediate contact pads, the first and second subsets being mutually-exclusive and having the same number of LEDs.
地址 Durham NC US