发明名称 |
Multi-die LED package |
摘要 |
A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads. |
申请公布号 |
US9082921(B2) |
申请公布日期 |
2015.07.14 |
申请号 |
US201213441620 |
申请日期 |
2012.04.06 |
申请人 |
Cree, Inc. |
发明人 |
Wilcox Kurt S.;Keller Bernd P.;Lowes Theodore;Andrews Peter Scott |
分类号 |
H01L33/00;H01L33/08;H01L33/48;H01L31/12;H01L33/62;H01L33/64;H01L25/075;H01L33/54;H01L33/40 |
主分类号 |
H01L33/00 |
代理机构 |
Jenkins, Wilson, Taylor & Hunt, P.A. |
代理人 |
Jenkins, Wilson, Taylor & Hunt, P.A. |
主权项 |
1. A light-emitting device comprising:
a submount having front and back sides and including a ceramic layer; an array of light emitting diodes (LEDs) on the front side; and an asymmetric lens overmolded on the submount and covering the LED array; wherein:
the submount comprises at least three contact pads, including a positive contact pad, a negative contact pad, and at least one intermediate contact pad;a first subset of the LEDs is secured with respect to one of the positive and negative contact pads; anda second subset of the LEDs is secured with respect to one of the at least one intermediate contact pads, the first and second subsets being mutually-exclusive and having the same number of LEDs. |
地址 |
Durham NC US |