发明名称 Substrate processing apparatus and method of manufacturing semiconductor device
摘要 A substrate processing apparatus capable of increasing the life span of a lamp for heating a substrate is provided. The substrate processing apparatus includes: a light receiving chamber for processing a substrate; a substrate support unit inside the light receiving chamber; a lamp including an electrical wire, and a seal accommodating the electrical wire to hermetically seal the lamp with a gas therein, the lamp irradiating the substrate with a light; a lamp receiving unit outside the light receiving chamber to accommodate the lamp therein, the lamp receiving unit including a lamp connector connected to the lamp to supply an electric current through the electrical wire, a heat absorption member including a material having a thermal conductivity higher than that of the seal, and a base member fixing the heat absorption member; and an external electrical wire connected to the lamp connector to supply current to the lamp connector.
申请公布号 US9082797(B2) 申请公布日期 2015.07.14
申请号 US201213536128 申请日期 2012.06.28
申请人 Hitachi Kokusai Electric, Inc. 发明人 Aburatani Yukinori;Shimada Toshiya;Shinozaki Kenji;Amano Tomihiro;Ashihara Hiroshi;Yanai Hidehiro;Miyake Masahiro;Hiyama Shin
分类号 H01L21/67;H05B3/08;H05B3/00;F27B5/14;H01L21/324;C23C16/48;F27B17/00;F27D9/00 主分类号 H01L21/67
代理机构 Edell, Shapiro & Finnan LLC 代理人 Edell, Shapiro & Finnan LLC
主权项 1. A substrate processing apparatus comprising: a light receiving chamber configured to process a substrate; a substrate support unit disposed inside the light receiving chamber to support the substrate; a lamp including: a lamp electrical wire; and a sealing part accommodating the lamp electrical wire therein to hermetically seal the lamp with a gas therein, the lamp being configured to irradiate the substrate supported by the substrate support unit with a light; a lamp receiving unit disposed outside the light receiving chamber to accommodate the lamp therein, the lamp receiving unit including: a lamp connection member connected to the lamp to supply an electric current through the lamp electrical wire; a heat absorption member covering the sealing part to absorb heat from the sealing part, the heat absorption member including a material having a thermal conductivity higher than that of the sealing part; and a base member fixing the heat absorption member, wherein the lamp connection member and the heat absorption member are inserted in the base member; and an external electrical wire connected to the lamp connection member to supply an electric current to the lamp connection member, wherein the sealing part of the lamp is covered by the heat absorption member, and wherein the heat absorption member covers the external electrical wire and is in contact with the external electrical wire.
地址 Tokyo JP