| 发明名称 |
Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package |
| 摘要 |
A embedded integrated circuit package is provided, the embedded integrated circuit package including: at least one chip arranged over a chip carrier, the at least one chip including a plurality of chip contact pads; encapsulation material formed over the chip carrier and at least partially surrounding the at least one chip; a plurality of electrical interconnects formed through the encapsulation material, wherein each electrical interconnect is electrically connected to a chip contact pad; and a structure formed between the electrical interconnects of the embedded integrated circuit package, wherein the structure increases the creepage resistance between the electrical interconnects. |
| 申请公布号 |
US9082767(B2) |
申请公布日期 |
2015.07.14 |
| 申请号 |
US201414151917 |
申请日期 |
2014.01.10 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Mahler Joachim;Fuergut Edward;Hosseini Khalil;Meyer-Berg Georg |
| 分类号 |
H01L21/56;H01L23/498;H01L23/48;H01L23/28;H01L21/58;H01L23/00;H01L23/538 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An embedded integrated circuit package comprising:
at least one chip arranged over a chip carrier, the at least one chip comprising a plurality of chip contact pads; encapsulation material formed over the chip carrier and at least partially surrounding the at least one chip; a plurality of electrical interconnects formed through the encapsulation material, wherein each electrical interconnect is electrically connected to a chip contact pad; and a structure formed between the electrical interconnects of the embedded integrated circuit package, wherein the structure increases the creepage resistance between the electrical interconnects. |
| 地址 |
Neubiberg DE |
