Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same

摘要

A three-dimensional integrated circuit (3D-IC) which incorporates a glass interposer and a method for fabricating the three-dimensional integrated circuit (3D-IC) with the glass interposer are described herein. In one embodiment, the 3D-IC incorporates a glass interposer which has vias formed therein which are not filled with a conductor that allow for precision metal-to-metal interconnects (for example) between redistribution layers. In another embodiment, the 3D-IC incorporates a glass interposer which has vias and has a coefficient of thermal expansion (CTE) that is different than the CTE of silicon which is 3.2 ppm/° C.

主权项

1. A three-dimensional integrated circuit comprising:
a first circuit component; one or more first redistribution layers, where one of the first redistribution layers has a plurality of first conductive pillars extending therefrom; a glass interposer having a body including a first surface and a second surface which are substantially parallel to each other, and where the body has a plurality of vias extending there through from the first surface to the second surface wherein the vias are not metallized; one or more second redistribution layers, where one of the second redistribution layers has a plurality of second conductive pillars extending therefrom; a second circuit component; the one or more first redistribution layers are positioned between the first circuit component and the first surface of the glass interposer; the one or more second redistribution layers are positioned between the second circuit component and the second surface of the glass interposer; and the glass interposer is positioned between the one first distribution layer and the one second distribution layer such that each one of the first conductive pillars contacts a corresponding one of the second conductive pillars, and where each pair of the first and second conductive pillars contact one another within one of the vias located in the glass interposer.