Semiconductor packages and methods of formation thereof

摘要

In accordance with an embodiment of the present invention, a semiconductor package includes a die paddle, and an encapsulant disposed around the die paddle. The semiconductor package has a first sidewall and a second sidewall. The second sidewall is perpendicular to the first sidewall. The first sidewall and the second sidewall define a corner region. A tie bar is disposed within the encapsulant. The tie bar couples the die paddle and extends away from the die paddle. A dummy lead is disposed in the corner region. The dummy lead is not electrically coupled to another electrically conductive component within the semiconductor package. The distance between the dummy lead and the tie bar is less than a shortest distance between the tie bar and other leads or other tie bars in the semiconductor package.

主权项

1. A semiconductor package comprising:
a first die paddle; an encapsulant disposed around the first die paddle, the semiconductor package having a first sidewall and a second sidewall, the second sidewall being perpendicular to the first sidewall, the first sidewall and the second sidewall defining a first corner region; a first tie bar disposed within the encapsulant, the first tie bar coupling the first die paddle and extending away from the first die paddle; and a first dummy lead disposed in the first corner region, the first dummy lead not being electrically coupled to another electrically conductive component within the semiconductor package, wherein a distance between the first dummy lead and the first tie bar is less than a shortest distance between the first tie bar and other leads or other tie bars in the semiconductor package.