发明名称 Half-FinFET semiconductor device and related method
摘要 According to one embodiment, a half-FinFET semiconductor device comprises a gate structure formed over a semiconductor body. The semiconductor body includes a source region comprised of a plurality of fins extending beyond a first side of the gate structure and a continuous drain region adjacent a second side of the gate structure opposite the plurality of fins. The continuous drain region causes the half-FinFET semiconductor device to have a reduced ON-resistance. A method for fabricating a semiconductor device having a half-FinFET structure comprises designating source and drain regions in a semiconductor body, etching the source region to produce a plurality of source fins while masking the drain region during the etching to provide a continuous drain region, thereby resulting in the half-FinFET structure having a reduced ON-resistance.
申请公布号 US9082751(B2) 申请公布日期 2015.07.14
申请号 US201113232737 申请日期 2011.09.14
申请人 BROADCOM CORPORATION 发明人 Chen Xiangdong;Xia Wei
分类号 H01L29/66;H01L29/423;H01L29/78;H01L29/06 主分类号 H01L29/66
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A half-FinFET semiconductor device comprising: a gate structure formed over a semiconductor body; said semiconductor body including a source region comprised of a plurality of fins extending beyond a first side of said gate structure; said semiconductor body further comprising a continuous drain region adjacent to a second side of said gate structure which is opposite of said plurality of fins; and a drain extension well that is formed in between the continuous drain region and the gate structure.
地址 Irvine CA US
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