发明名称 |
Half-FinFET semiconductor device and related method |
摘要 |
According to one embodiment, a half-FinFET semiconductor device comprises a gate structure formed over a semiconductor body. The semiconductor body includes a source region comprised of a plurality of fins extending beyond a first side of the gate structure and a continuous drain region adjacent a second side of the gate structure opposite the plurality of fins. The continuous drain region causes the half-FinFET semiconductor device to have a reduced ON-resistance. A method for fabricating a semiconductor device having a half-FinFET structure comprises designating source and drain regions in a semiconductor body, etching the source region to produce a plurality of source fins while masking the drain region during the etching to provide a continuous drain region, thereby resulting in the half-FinFET structure having a reduced ON-resistance. |
申请公布号 |
US9082751(B2) |
申请公布日期 |
2015.07.14 |
申请号 |
US201113232737 |
申请日期 |
2011.09.14 |
申请人 |
BROADCOM CORPORATION |
发明人 |
Chen Xiangdong;Xia Wei |
分类号 |
H01L29/66;H01L29/423;H01L29/78;H01L29/06 |
主分类号 |
H01L29/66 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A half-FinFET semiconductor device comprising:
a gate structure formed over a semiconductor body; said semiconductor body including a source region comprised of a plurality of fins extending beyond a first side of said gate structure; said semiconductor body further comprising a continuous drain region adjacent to a second side of said gate structure which is opposite of said plurality of fins; and a drain extension well that is formed in between the continuous drain region and the gate structure. |
地址 |
Irvine CA US |