| 发明名称 | Circuit module | ||
| 摘要 | A circuit module can include a substrate, photonic conversion units placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion units and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion units. The plurality of photonic conversion units are removably secured to the substrate by the retention assembly without the use of a bonding material. | ||
| 申请公布号 | US9082745(B2) | 申请公布日期 | 2015.07.14 |
| 申请号 | US201013640290 | 申请日期 | 2010.04.30 |
| 申请人 | Hewlett-Packard Development Company, L.P. | 发明人 | Morris Terrel |
| 分类号 | H05K7/20;H01L23/40;H01L25/16;H04N5/225;H04N5/335;H05K3/32;H01L23/42;H01L23/00;H01L27/146 | 主分类号 | H05K7/20 |
| 代理机构 | Hewlett-Packard Patent Department | 代理人 | Hewlett-Packard Patent Department |
| 主权项 | 1. A circuit module comprising: a substrate; a plurality of photonic conversion units placed on the substrate; and a retention assembly, comprising: a heat sink situated in thermal contact with the plurality of photonic conversion units; anda fastener mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the plurality of photonic conversion units, wherein the plurality of photonic conversion units are removably secured to the substrate by the retention assembly without the use of a bonding material. | ||
| 地址 | Houston TX US | ||