发明名称 Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
摘要 A positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent; and a pattern forming method using the positive resist composition.
申请公布号 US9081279(B2) 申请公布日期 2015.07.14
申请号 US201414158490 申请日期 2014.01.17
申请人 FUJIFILM Corporation 发明人 Kanda Hiromi;Kanna Shinichi
分类号 G03F7/039;G03F7/004;G03F7/075;G03F7/20;G03F7/30;C07C69/653 主分类号 G03F7/039
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A positive resist composition, which comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent, wherein: the amount added of the resin (C) is 0.1 to 5 mass %, based on the entire solids content of the positive resist composition; the resin (C) is a linear polymer; and the resin (C) contains hexafluoroisopropanol.
地址 Tokyo JP