发明名称 |
Bypass capacitors for high voltage bias power in the mid frequency RF range |
摘要 |
A system for decoupling arcing RF signals in a plasma chamber including a top electrode, an electrostatic chuck for supporting a semiconductor wafer, and a capacitor coupled between the at least one of a plurality of clamping electrodes in the surface of the electrostatic chuck and a baseplate of the electrostatic chuck, the capacitor having a capacitance of greater than about 19 nanofarads, the capacitor disposed within an interior volume of the electrostatic chuck. A method of decoupling arcing RF signals in a plasma chamber is also disclosed. |
申请公布号 |
US9083182(B2) |
申请公布日期 |
2015.07.14 |
申请号 |
US201213684065 |
申请日期 |
2012.11.21 |
申请人 |
Lam Research Corporation |
发明人 |
Sato Arthur |
分类号 |
H01T23/00;H02H3/46;H05F3/00;H01J37/32;H01L21/67;H01L21/687;H01L21/683 |
主分类号 |
H01T23/00 |
代理机构 |
Martine Penilla Group, LLP |
代理人 |
Martine Penilla Group, LLP |
主权项 |
1. A system for decoupling arcing RF signals in a plasma chamber comprising:
a plasma chamber including:
a top electrode;an electrostatic chuck for supporting a semiconductor wafer; anda capacitor coupled between the at least one of a plurality of clamping electrodes in the surface of the electrostatic chuck and a baseplate of the electrostatic chuck, the capacitor having a capacitance of greater than about 19 nanofarads, the capacitor disposed within an interior volume of the electrostatic chuck;a plurality of lift pins supported in a corresponding plurality of lift pin holes in the surface of the electrostatic chuck, wherein each one of the plurality of lift pins has a clearance of less than about 0.011 inches (0.25 mm) between a corresponding side in a corresponding one of a plurality of lift pin holes in the surface of the electrostatic chuck. |
地址 |
Fremont CA US |