Light emitting diode assembly and method for fabricating the same

摘要

The present invention is directed to a light emitting diode (LED) assembly and a method for fabricating the same. According to the present invention, there is provided an LED assembly comprising an LED comprising at least an N-type semiconductor layer and a P-type semiconductor layer; and bumps provided on the LED and electrically connected to the semiconductor layers, wherein the bump comprises a first region made of a gold (Au) compound including tin (Sn) and a second region made of gold.

主权项

1. A light emitting diode (LED) assembly, comprising:
an LED comprising an N-type semiconductor layer and a P-type semiconductor layer; bumps disposed on the LED and electrically connected to the semiconductor layers; electrode pads electrically connected to the semiconductor layers; an N-pad disposed between the N-type semiconductor layer and a first bump among the bumps; and a P-pad disposed between the P-type semiconductor layer and a second bump among the bumps, wherein the bumps comprise a first region comprising gold (Au) and tin (Sn), a second region comprising gold, and a third region disposed between the first region and the second region, the third region comprising a diffusion barrier layer comprising nickel (Ni), and wherein the first region contacts an electrode pad among the electrode pads, and the second region is disposed between the first region and a semiconductor layer among the semiconductor layers.