| 发明名称 | Microelectronic component and corresponding production process | ||
| 摘要 | A microelectronic component includes a semiconductor substrate having a top side and a reverse side, an elastically movable mass device on the top side of the substrate, at least one source region provided in or on the mass device, at least one drain region provided in or on the mass device, and a gate region suspended on a conductor track arrangement above the at least one source region and at least one drain region and spaced apart from the mass device by a gap. The conductor track arrangement is anchored on the top side of the substrate in a periphery of the mass device such that the gate region remains fixed when the mass device has been moved. | ||
| 申请公布号 | US9082882(B2) | 申请公布日期 | 2015.07.14 |
| 申请号 | US201314032649 | 申请日期 | 2013.09.20 |
| 申请人 | Robert Bosch GmbH | 发明人 | Schelling Christoph;Feyh Ando |
| 分类号 | H01L29/84;H01L21/306;B81B3/00;H01L29/66;B81C1/00;G01P15/12 | 主分类号 | H01L29/84 |
| 代理机构 | Maginot, Moore & Beck LLP | 代理人 | Maginot, Moore & Beck LLP |
| 主权项 | 1. A microelectronic component comprising: a semiconductor substrate including a top side and a reverse side; an elastically movable mass device on the top side of the substrate; at least one source region located in or on the mass device; at least one drain region located in or on the mass device; and at least one gate region suspended on a conductor track arrangement above the at least one source region and the at least one drain region and spaced apart from the mass device by a gap, wherein the conductor track arrangement is anchored on the top side of the substrate in a periphery of the mass device, such that the at least one gate region remains fixed when the mass device has been moved; and wherein the mass device is connected to the periphery via a spring device integrated within the substrate. | ||
| 地址 | Stuttgart DE | ||