主权项 |
1. A semiconductor device comprising a semiconductor substrate including a cell region and a non-cell region arranged around the cell region, wherein:
the cell region comprises: a first semiconductor region of a first conductivity type; a second semiconductor region of a second conductivity type formed on a surface of the semiconductor substrate on a front surface side of the first semiconductor region; an insulated gate of a trench type extending from a surface side of the semiconductor substrate through the second semiconductor region to a depth where the insulated gate is in contact with the first semiconductor region, a lengthwise direction of the insulated gate being extended in a first direction; and a first trench conductor formed at least partially in the cell region between the insulated gate and the non-cell region, and having a conductor that is covered with an insulation film and fills a trench, the first trench conductor includes a first portion extending in the first direction, and a second portion protruding in a second direction perpendicularly crossing the first direction and extending from a cell region side toward the non-cell region, and at least a part of a bottom of the second portion reaches a position deeper than a boundary between the first and second semiconductor regions; wherein the semiconductor device, further comprising: a second trench conductor formed at least partially in the cell region between the first portion of the first trench conductor and the non-cell region, and having a conductor that is covered with the insulation film and fills a trench, wherein: the second trench conductor is positioned in the second direction with respect to the first portion of the first trench conductor, a length of the second trench conductor in the first direction is shorter than a length of the insulated gate in the first direction, a distance between the first portion of the first trench conductor and the second trench conductor is shorter than a distance between the first trench conductor and the insulated gate nearest to the first trench conductor, and at least a part of the second trench conductor reaches a position deeper than the boundary between the first and second semiconductor regions. |