发明名称 |
3C-SiC transistor |
摘要 |
A bipolar power semiconductor transistor is disclosed. The transistor includes a semiconductor substrate of a first conductivity type, a first semiconductor region of the first conductivity type disposed on the semiconductor substrate; a semiconductor drift region of a second conductivity type, opposite the first conductivity type, disposed on the first semiconductor region, a body region of the first conductivity type located within the semiconductor drift region, a source region of the second conductivity type located within the body region, a gate placed above and in contact to the source region, the gate to control charge in a channel region between the semiconductor drift region and the source region and to thereby control flow of charge within the semiconductor drift region. The semiconductor substrate includes a material having silicon (Si) and the first semiconductor region includes a material having 3-step cubic silicon carbide (3C-SiC). |
申请公布号 |
US9082811(B2) |
申请公布日期 |
2015.07.14 |
申请号 |
US201314034024 |
申请日期 |
2013.09.23 |
申请人 |
Anvil Semiconductors Limited |
发明人 |
Ward Peter |
分类号 |
H01L29/15;H01L29/739;H01L21/02;H01L29/66;H01L29/04;H01L29/16;H01L29/74 |
主分类号 |
H01L29/15 |
代理机构 |
Renner, Otto, Boisselle & Sklar, LLP |
代理人 |
Renner, Otto, Boisselle & Sklar, LLP |
主权项 |
1. A bipolar power semiconductor transistor comprising:
a semiconductor substrate of a first conductivity type; a first semiconductor region of the first conductivity type disposed on the semiconductor substrate; a semiconductor drift region of a second conductivity type, opposite the first conductivity type, disposed on the first semiconductor region; a body region of the first conductivity type located within the semiconductor drift region; a source region of the second conductivity type located within the body region; a gate placed above and in contact to the source region, the gate to control charge in a channel region between the semiconductor drift region and the source region and to thereby control flow of charge within the semiconductor drift region; wherein the semiconductor substrate comprises a material comprising silicon (Si) and the first semiconductor region comprises a material comprising 3-step cubic silicon carbide (3C-SiC). |
地址 |
Warwickshire GB |