Substrate polishing apparatus

摘要

A substrate polishing apparatus includes a retainer for holding a substrate and substrate rotating device that spins the retainer around a first rotational axis perpendicular to a to-be-polished surface of the substrate. A platen includes an abrasive pad disposed opposite of the to-be-polished surface of the substrate. A platen rotating device spins the platen around a second rotational axis perpendicular to the abrasive pad. A liquid storage chamber includes a wall portion surrounding the outer periphery of the substrate. One end of the wall portion is positionable in a liquid-tight manner with the abrasive pad to define a liquid storage space for retaining a polishing liquid around the outer periphery of the substrate.

主权项

1. A substrate polishing apparatus comprising:
a substrate supporting member for holding a substrate having a to-be-polished surface; substrate rotating means for spinning the substrate supporting member around a first rotational axis perpendicular to the to-be-polished surface of the substrate; a platen having a platen surface disposed opposite of the to-be-polished surface of the substrate; platen rotating means for spinning the platen around a second rotational axis perpendicular to the platen surface; and a liquid storage chamber including a wall portion surrounding an outer periphery of the substrate supporting member and overlapping the outer periphery of the substrate supporting member in the direction of the first rotational axis, one end of the wall portion configured to be positioned in a liquid-tight manner in abutment with or proximal to the platen surface to form a liquid storage space capable of retaining a polishing liquid around the outer periphery of the substrate.