Semiconductor chip bonding apparatus and method of forming semiconductor device using the same

摘要

A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; positioning the first substrate on the carrier line and positioning the first moveable tray to vertically align the first chip mounting region of the first substrate with the first semiconductor chip; when the first chip mounting region of the first substrate is aligned with the first semiconductor chip, performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and subsequent to the initial bonding, performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region, wherein the initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.