发明名称 |
Hardening resin composition, sealing material, and electronic device using the sealing material |
摘要 |
A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.; |
申请公布号 |
US9082709(B2) |
申请公布日期 |
2015.07.14 |
申请号 |
US201414208009 |
申请日期 |
2014.03.13 |
申请人 |
DENSO CORPORATION |
发明人 |
Okuhira Hiroyuki;Takakura Akira;Katou Hiroshi |
分类号 |
H01L23/29 |
主分类号 |
H01L23/29 |
代理机构 |
Harness, Dickey & Pierce, PLC |
代理人 |
Harness, Dickey & Pierce, PLC |
主权项 |
1. A hardening resin composition comprising:
a base resin; and a hardening agent, wherein the base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a following general chemical formula (1): wherein A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, n is a natural number of 1 to 10; and in the general chemical formula (1), benzene skeletons are connected in a meta position or a para position through the atom A. |
地址 |
Kariya JP |