发明名称 Ceramic electronic component
摘要 A ceramic electronic component includes an electronic component body and first and second metal terminals. The electronic component body includes a bare ceramic body and first and second outer electrodes. The first and second outer electrodes of the electronic component body are connected respectively to the first and second metal terminals by solders containing Sn as a main constituent. An alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between adjacent two of the first and second metal terminals and the first and second outer electrodes.
申请公布号 US9082532(B2) 申请公布日期 2015.07.14
申请号 US201414453880 申请日期 2014.08.07
申请人 Murata Manufacturing Co., Ltd. 发明人 Itagaki Yoji;Kimura Nobumichi;Matsuda Tomoaki
分类号 H01F27/29;H01C7/00;H01G4/228;H01L41/047;H01G4/30;H01L41/083;H01F27/28 主分类号 H01F27/29
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A ceramic electronic component comprising: an electronic component body including a bare ceramic body including two principal surfaces opposed to each other, two end surfaces opposed to each other, and two lateral surfaces opposed to each other, and outer electrodes arranged to cover the end surfaces of the bare ceramic body; and first and second metal terminals connected to the outer electrodes by solder containing Sn as a main constituent; wherein at least a Ni-plated film is provided on a surface layer portion of each of the outer electrodes; at least a Ni-plated film is provided on a surface layer portion of each of the first and second metal terminals; and an alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between an adjacent pair of the outer electrodes and the first and second metal terminals in a central region of each of the end surfaces.
地址 Kyoto JP