Lithographic apparatus and device manufacturing method

摘要

An apparatus, in an embodiment, having a patterning device support including a first planar element having a first flow-restricting surface; a second planar element including a second flow-restricting surface facing the first flow-restricting surface; a support driver to linearly move the support along a certain direction relative to the second planar element, wherein the first and/or second flow-restricting surface has one or more projections and/or recesses between the first and second flow-restricting surfaces, and wherein the projection and/or recess on the first and/or second flow-restricting surface is arranged to provide a flow resistance, per unit width of the first and/or second flow-restricting surface perpendicular to the flow, that is lower against flow that is parallel to the certain direction than against flow that is perpendicular to the certain direction. The flow-restricting surfaces may direct gas flow onto a driver part that generates heat.

主权项

1. A lithographic apparatus comprising:
a support constructed to support a patterning device, the patterning device being capable of imparting a radiation beam with a pattern in its cross-section to form a patterned radiation beam, the support comprising a first planar element having a first generally horizontal flow-restricting surface; a projection system configured to project the patterned radiation beam onto a target portion of a substrate; a second planar element comprising a second generally horizontal flow-restricting surface facing the first flow-restricting surface; and a support driver to drive movement of the support relative to the second planar element, wherein the first flow-restricting surface, the second flow-restricting surface, or both the first and second flow-restricting surfaces, comprises a projection and/or recess between the first and second flow-restricting surfaces, wherein the support driver is configured to drive the support linearly along a certain generally horizontal direction relative to the second planar element, and wherein the projection and/or recess on the first and/or second flow-restricting surface is arranged to provide a flow resistance, per unit width of the first and/or second flow-restricting surface perpendicular to a direction of flow, that is lower against flow that is parallel to the certain direction than against flow in a generally horizontal direction that is perpendicular to the certain direction.