发明名称 Light-emitting module
摘要 A light-emitting module includes a printed circuit board (PCB) and a light emitting package. A hole is formed through the PCB. The light emitting package has a light source and a lead, and is disposed on the PCB. The light emitting package has a stepped portion having predetermined height. The stepped portion is disposed in the hole formed through the PCB. Thus, a thickness of the light-emitting module may be decreased, reliability of the light-emitting module may be enhanced, and thus a thickness and a bezel of a display apparatus may be decreased.
申请公布号 US9081226(B2) 申请公布日期 2015.07.14
申请号 US201213653231 申请日期 2012.10.16
申请人 SAMSUNG DISPLAY CO., LTD. 发明人 Kim Jung-Hyun;Park Young-Min;Kang Seok-Won;Son Young-Hye
分类号 G02F1/1335;H05K1/18;H05K1/02 主分类号 G02F1/1335
代理机构 Innovation Counsel LLP 代理人 Innovation Counsel LLP
主权项 1. A light-emitting module comprising: a printed circuit board (PCB) through which a hole is formed; and a light emitting package having a light source and a lead, and disposed on the PCB, wherein a protecting material comprises a stepped portion and a top portion, wherein the stepped portion and a portion of the light source are disposed in the hole formed through the PCB, wherein a width of the top portion of the protecting material is greater than a width of the hole formed through the PCB, wherein the light source is covered by the protecting material and disposed in contact with the protecting material, and wherein the protecting material includes a groove extending through a portion of the protecting material and defining a path along which light from the light source travels.
地址 KR