| 发明名称 | Periphery coating apparatus, periphery coating method and storage medium therefor | ||
| 摘要 | There is provided a periphery coating method of coating a coating liquid on a periphery region of a substrate. The method includes performing a scan-in process of moving the coating liquid nozzle from an outside of an edge of the substrate to a position above the periphery region of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle; and performing a scan-out process of moving the coating liquid nozzle from the position above the periphery region of the substrate to the outside of the edge of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle. Further, in the scan-out process, the coating liquid nozzle is moved at a speed lower than a speed at which the coating liquid is moved to a side of an edge of the substrate. | ||
| 申请公布号 | US9082614(B1) | 申请公布日期 | 2015.07.14 |
| 申请号 | US201514682268 | 申请日期 | 2015.04.09 |
| 申请人 | TOKYO ELECTRON LIMITED | 发明人 | Hatakeyama Shinichi;Sato Yoshitomo;Tashiro Kazuyuki;Kishita Naofumi |
| 分类号 | H01L21/31;H01L21/02 | 主分类号 | H01L21/31 |
| 代理机构 | Pearne & Gordon LLP | 代理人 | Pearne & Gordon LLP |
| 主权项 | 1. A periphery coating method of coating a coating liquid on a periphery region of a substrate, the method comprising: performing a scan-in process of moving the coating liquid nozzle from an outside of an edge of the substrate to a position above the periphery region of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle; and performing a scan-out process of moving the coating liquid nozzle from the position above the periphery region of the substrate to the outside of the edge of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle, wherein, in the scan-out process, the coating liquid nozzle is moved at a speed lower than a speed at which the coating liquid is moved to a side of an edge of the substrate. | ||
| 地址 | Tokyo JP | ||