Method of embedding an electronic component into an aperture of a substrate

摘要

Representative implementations of devices and techniques provide improved electrical access to components, such as chip dice, for example, disposed within layers of a multi-layer printed circuit board (PCB). One or more insulating layers may be located on either side of a spacer layer containing the components. The insulating layers may have apertures strategically located to provide electrical connectivity between the components and conductive layers of the PCB.

主权项

1. A method, comprising:
depositing a first set of one or more forms onto a surface of a first conductive layer; depositing a first layer of dielectric material onto the first conductive layer, around the first set of one or more forms; depositing a spacer layer having one or more apertures onto the dielectric material and the one or more forms; and placing one or more electrical components into the one or more apertures in the spacer layer, the one or more electrical components arranged to be electrically coupled to a portion of the first conductive layer via one or more apertures formed in the first layer of dielectric material, based on the first set of one or more forms.