Multi-die integrated circuit structure with heat sink

摘要

An integrated circuit structure can include a first die including a first surface and a second surface and a second die including a first surface and a second surface. The first surface of the first die can be coupled to the second surface of the second die. The integrated circuit structure also can include a heat sink coupled to the first surface of the first die and the first surface of the second die.

主权项

1. An integrated circuit structure, comprising:
a first die comprising a first surface and a second surface; a second die comprising a first surface and a second surface; wherein the first die and the second die are semiconductor dice; wherein the second die is mounted on the first die with the second surface of the second die facing the first surface of the first die; and a heat sink mounted on the first surface of the first die and the first surface of the second die; wherein the first die is an interposer and comprises a first thermal wire coupled to the heat sink; wherein the first thermal wire is not configured to propagate an electrical signal; wherein the first thermal wire comprises a first portion formed of a via coupled to the heat sink and extending from the first surface of the interposer and into the interposer and a second portion formed of a first interconnect layer within the interposer that is parallel to the surface of the interposer and perpendicular to the via; and wherein the second die comprises a second thermal wire coupled to the heat sink, and the second thermal wire comprises a first portion formed of a via coupled to the heat sink and extending from the first surface of the second die and into the second die and a second portion formed of an interconnect layer of the second die that is parallel to the surface of the interposer and perpendicular to the via of the second thermal wire.