METHOD AND APPARATUS FOR PROCESSING PANEL

摘要

A method and an apparatus for processing a panel are disclosed. The method for processing a panel comprises: a step of supplying a layered panel having a middle layer disposed between a first layer and a second layer; a step of drilling the second panel up to a prescribed depth along a perimeter of a target hole; and a step of removing a portion of the second panel remaining inside the perimeter to expose the fist panel and/or the middle layer through the hole. By using a precision control technique for a high sensitivity measurement sensor and a core drill, the perimeter is drilled in the TFT panel until a thickness of 10 to 100μm remains, and then the remaining core portion is removed by using a brittle property of a glass to maintain the strength of the remaining glass panel after processing without damaging the glass panel at all, and effectively reduce the thickness of a portion of the display panel on which a camera module or the like is installed.