Airflow module and data storage device enclosure

摘要

An airflow module for being received in a module bay of a data storage device enclosure is disclosed. The airflow module comprises a body having: a first face having a first opening therein; a second face having a second opening therein, the first face being adjacent to the second face; and, an airflow channel between the first opening and the second opening so as to allow the passage of air between the first opening and the second opening. The first and second openings are arranged to co-operate with airflow openings in modules positioned in adjacent bays of a said data storage device enclosure to direct a cooling stream of air between said modules in use. The airflow channel is free from components that generate substantial amounts of heat in their normal operation.

主权项

1. A device enclosure comprising:
an enclosure housing having a front end and a rear end; a plurality of data devices arranged within the enclosure housing adjacent the front end thereof; an electronics module disposed within the enclosure housing adjacent the rear end thereof comprising electronics for controlling the data devices, the electronics disposed within a rectilinear electronics module housing having opposing front and rear faces, opposing side faces and opposing top and bottom faces, the front face of the electronics module housing having an inlet opening in facing relation to the data devices, a selected one of the top or bottom faces of the electronics module housing having a first vent aperture extending therethrough, a selected one of the opposing side faces of the electronics module housing having a second vent aperture extending therethrough; an airflow module disposed within the enclosure housing adjacent the rear end thereof comprising an empty rectilinear airflow module housing having opposing front and rear faces, opposing side faces and opposing top and bottom faces, the front face of the airflow module housing comprising a solid blocking surface in facing relation to the data devices, a selected one of the top or bottom faces of the airflow module housing having a third vent aperture extending therethrough, a selected one of the side faces of the airflow module housing having a fourth vent aperture extending therethrough, the airflow module housing in contacting engagement with the electronics module housing so that the first vent aperture is in facing relation and fluidic communication with the third vent aperture; and a fan assembly disposed within the enclosure housing adjacent the electronics module and the airflow module, the fan assembly configured to draw cooling air from the front end of the enclosure housing to the rear end of the enclosure housing along a first path that passes from the inlet opening of the front face of the electronics module and out the second vent aperture and along a separate, second path that passes through the first vent aperture, the third vent aperture and the fourth vent aperture.