| 发明名称 | Method of manufacturing a substrate having a voltage switchable dielectric material | ||
| 摘要 | A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member. | ||
| 申请公布号 | US9084354(B2) | 申请公布日期 | 2015.07.14 |
| 申请号 | US201213597152 | 申请日期 | 2012.08.28 |
| 申请人 | LITTELFUSE, INC. | 发明人 | Fleming Robert;Kosowsky Lex;Shang Shurui;Graydon Bhret;Chen Xiaofeng;Irvin Glen |
| 分类号 | H05K3/10;H05K1/02;H05K1/03;H05K3/00 | 主分类号 | H05K3/10 |
| 代理机构 | Kacvinsky Daisak Bluni PLLC | 代理人 | Kacvinsky Daisak Bluni PLLC |
| 主权项 | 1. A method for manufacturing a printed circuit board (PCB), the method comprising: coating a voltage switchable dielectric material on a copper foil; curing the voltage switchable dielectric material; forming an arcuate portion of the copper foil from the curing; and attaching the arcuate portion of the copper foil to a layer of the PCB. | ||
| 地址 | Chicago IL US | ||