| 摘要 |
<p>The present invention provides a manufacturing method of a printed circuit board for a light emitting diode (LED) apparatus, which comprises: a step of preparing a substrate; a step of performing a primary surface treatment to one surface of the substrate; a step of printing a circuit pattern on the one surface undergone the primary surface treatment by using a screen; a step of directly drying the printed surface by injecting ultraviolet (UV) light to the printed surface; a step of etching and peeling off the printed surface of the substrate, which is primarily dried by injecting the UV light; a step of performing a secondary surface treatment to the printed surface peeled off; a step of performing a solder resist (SR) printing to the printed surface of the substrate which has undergone the secondary surface treatment; a step of indirectly drying the printed surface by injecting UV light through a rear surface of the substrate; and a step of drying the printed surface, which is indirectly dried by injecting the UV light, by using IR light. The manufacturing method of a printed circuit board for a light emitting diode (LED) apparatus is an eco-friendly method with high productivity and remarkably reduces bleaching of white colored paint in the drying process.</p> |
