| 摘要 |
FIELD: physics.SUBSTANCE: this invention relates to electronic device 50 including conducting main ply 10. First ply 16 composed of conducting material is applied on both surfaces thereof. Note here that first ply recess 18 accommodates at least one electronic component. Said first ply is covered in every case by insulating heat-conducting ply 34, 36 with extra ply 22, 26 arranged thereon. Said extra ply is composed by conducting material and coated in every case by cover ply 38 of electrically conducting material. Note here that said electronic device has through metalised holes 24 made of cover ply material to extend through insulating heat conducting ply 36, covering electronic component 20 and extra ply 22. It is made of electrically and heat conducting material to allow the contact with electronic component 20.EFFECT: lower costs, decreased sizes, higher reliability.16 cl, 13 dwg |
